Sponsors & Exhibitors

Early Version...... First Come, First Served!

The 38th International Symposium on Power Semiconductor Devices and ICs (ISPSD) will be held from May 24–28, 2026, at the MGM Grand Convention Center in Las Vegas, Nevada, USA. IEEE ISPSD is the premier forum for technical discussions in all areas of power semiconductor devices and power integrated circuits, with an annual attendance of 500 or more engineers, scientists, professors, and students from around the world.

ISPSD2026 will be held in Las Vegas, Nevada, routinely ranked as one of the top locations for conferences in the world. Its central location with a major international airport will make it easily accessible for all global attendees. Beyond logistics, the city offers a diverse range of dining and entertainment options, and direct access to amazing natural wonders like the famous Grand Canyon National Park.

A three‑and‑a‑half‑day exhibition will be held in conjunction with the technical symposium, providing a unique opportunity for exhibitors to showcase their products and services closely related to the power semiconductor industry. Each sponsorship and exhibition package includes extensive sponsor/exhibitor logo exposure in symposium materials, the official website, announcement slides in symposium rooms, and more. This is an essential opportunity to promote your presence and profile to researchers, engineers, and potential customers.

We would like to graciously ask for your support and cooperation to make ISPSD2026 another great success in the rich history of the world’s foremost power semiconductor conference.

General Inquiries related to Sponsorship & Exhibition:

General Chair: David Sheridan
Alpha & Omega Semiconductor, USA
david.sheridan@us.aosmd.com

Exhibition Chair: Pete Losee
Onsemi, USA
Pete.losee@onsemi.com

ALL SPONSORSHIP OPPORTUNITIES ARE AVAILABLE AND ALLOCATED ON A FIRST-COME, FIRST-SERVED BASIS
Additional Sponsorship Opportunities Coming Soon…
ALL EXHIBITION SPACES ARE ALLOCATED ON A FIRST-COME, FIRST-SERVED BASIS

Exhibition Outline

Venue:
MGM Grand Conference Center, connected to the world famous MGM Grand Hotel, Las Vegas, Nevada, USA
Dates:
Bump-in / Setting up: May 24, 2026 (Sun.) 13:00 ~ (to be confirmed)
Exhibition hours:
  • May 25 (Mon.) 8:30–17:30
  • May 26 (Tue.) 8:30–17:30
  • May 27 (Wed.) 8:30–17:30
  • May 28 (Thu.) 8:30–13:30
Dismantle/Bump-out: May 28 (Thu.) 12:00~ (to be confirmed)
* Schedule is subject to change. Finalized schedule to be shared in due course.
Exhibition Area:
Directly outside main lecture area, in break area on the 3rd floor
(also adjacent to Poster presentation area)
Exhibition Fee:
$4,000 per booth.
Up to 2 booths can be booked per company.
Booth can be chosen on a first-come, first-served basis.
Number of Exhibition booth:
Maximum of 24
Once all booths are fully booked, the application will be closed.
Benefits:
PR opportunities:
Company logo on the official website, screen in the symposium hall, symposium program book, and signboards/banners.

Participation benefits:
1 Complimentary ticket for admission to the following:
  • Symposium
  • Welcome Reception
  • Banquet
3 exhibitor badges to attend the booth (no access to sessions, lunches)

Booth Specifications

10' x 10' in-line booth space with black drape

  • 8′ High Back wall & 3′ High Side Rail Drape
  • Standard Booth ID Sign
  • 6′ W × 30″ H Draped Table
  • 120V / 5A outlets
  • (2) Side Chairs
  • (1) Wastebasket
Booth specifications

Exhibition Layout (3rd Floor)

Venue:
MGM Grand Conference Center,
connected to the world famous MGM Grand Hotel,
Las Vegas, Nevada, USA
TEL: +1 (800) 929-1112
Exhibition Area:
3rd floor conference rooms 359-370
  • Coffee service during break times will be provided in exhibition area
  • Connecting booth is available but first-come, first served basis0
  • Oral sessions and Poster presentations are adjacent to exhibition area on same floor

Floorplan

Booth specifications

How to Apply Early

You can apply early by directly contacting the General Chair (Dr. David Sheridan) or Exhibition Chair (Dr. Pete Losee) via email.

General Chair: David Sheridan
Alpha & Omega Semiconductor, USA
david.sheridan@us.aosmd.com

Exhibition Chair: Pete Losee
Onsemi, USA
Pete.losee@onsemi.com

Payment Method:


After confirming your application, the Sponsor Secretariat Office will issue an invoice. Please transfer the invoiced amount to the designated bank account within one month of the invoice date. All payments should be made in US Dollar ($), and bank transfer charges are to be borne by the remitter company.


Cancellation Policy:


  • No cancellations will be accepted after payment. However, if cancellation is caused by unavoidable reasons, please write to the organizer for the circumstances, and the organizer has the right to accept/decline the cancellation/withdrawal requests. If cancellation is approved, you may be charged for expenses incurred at that time.

  • The exhibition period and venue may be changed due to unavoidable circumstances. In principle, applications cannot be cancelled due to such changes. In the event of a postponement, applications that have already been submitted will, in principle, be moved to the postponed date. No compensation will be provided for damages caused by these changes.